Plasma-discharge processing apparatus and method therefor

プラズマ放電処理装置およびプラズマ放電処理方法

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plasma-discharge processing apparatus and method therefor whereby the density of atomic oxygen radicals is improved properly and the control of a plasma-discharge processing is made at a low cost, in the plasma-discharge processing performed under a nearly atmospheric pressure by using the mixed gas of nitrogen and oxygen gases. <P>SOLUTION: The plasma-discharge processing apparatus 1 for performing a plasma-discharge processing under a nearly atmospheric pressure by using the mixed gas of nitrogen and oxygen gases has: a pair of opposite electrodes 2, 3 whose gap is used as a discharging space 9; a voltage applying device 4 for applying a voltage to both or one of the opposite electrodes 2, 3; a gas feeding device 5 for feeding the mixed gas to the discharging space 9; a spectroscope 7 for measuring by a luminous-spectrum analyzing method the luminous intensity of the mixed gas brought into a plasma; and a controller 8 for adjusting processing conditions on the basis of the luminous intensity of a specific wavelength corresponding to the peak of the luminous spectrum of nitrogen monoxide of the measured luminous intensities to make the processing apparatus 1 perform the plasma-discharge processing. <P>COPYRIGHT: (C)2007,JPO&INPIT
【課題】大気圧近傍の圧力下で窒素ガスと酸素ガスとが混合された混合ガスを用いて行うプラズマ放電処理で、原子状酸素ラジカルの密度を的確に高めることができ、かつ安価に制御を行うことが可能なプラズマ放電処理装置およびプラズマ放電処理方法を提供する。 【解決手段】窒素ガスと酸素ガスとが混合された混合ガスを用いて大気圧近傍の圧力下でプラズマ放電処理を行うプラズマ放電処理装置1は、間隙部分が放電空間9とされた一対の対向電極2、3と、対向電極2、3の両方または一方に電圧を印加する電圧印加装置4と、放電空間9に混合ガスを供給するガス供給装置5と、プラズマ化された混合ガスの発光強度を発光分光法により計測する分光器7と、計測された発光強度のうち一酸化窒素の発光スペクトルのピークに相当する特定の波長の発光強度に基づいて処理条件を調整してプラズマ放電処理を行わせる制御装置8とを備える。 【選択図】図1

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Cited By (3)

    Publication numberPublication dateAssigneeTitle
    JP-2009233482-AOctober 15, 2009Institute Of National Colleges Of Technology Japan, 独立行政法人国立高等専門学校機構大気圧プラズマによる粒子清浄方法
    US-2013256266-A1October 03, 2013Andreas FischerMethods and apparatuses for effectively reducing gas residence time in a plasma processing chamber
    US-9299541-B2March 29, 2016Lam Research CorporationMethods and apparatuses for effectively reducing gas residence time in a plasma processing chamber