Flattening resin layer and semiconductor device having the same, and display apparatus

平坦化樹脂層、並びにそれを有する半導体装置及び表示体装置

Abstract

PROBLEM TO BE SOLVED: To provide a flattening film having excellent heat resistance, low water absorptivity, electric insulating property, transparency, solvent resistance and filling property for level difference, and to provide a semiconductor device using the film, and a display apparatus. SOLUTION: The flattening resin layer is obtained by applying the following resin composition on a substrate having level difference to form a resin composition layer, irradiating the resin composition layer with active energy rays, bringing a developer solution into contact with the layer to form a pattern, and thermally curing the composition at ≤280°C. The resin composition contains (A) a cyclic olefin resin having an acidic group in a side chain, (B) a photosensitive material having a 1,2-naphthoquinone diazido structure, and (C) a compound having ≤120°C softening point and a reactive group which can be bonded with the acidic group in (A) at ≥130°C. COPYRIGHT: (C)2006,JPO&NCIPI
【課題】 耐熱性、低吸水性、電気絶縁性、透明性、耐溶剤性、さらに段差埋め込み性に優れた平坦化膜及びそれを用いた半導体装置、表示装置を提供する。 【解決手段】 酸性基を側鎖に有する環状オレフィン系樹脂(A)、1,2−ナフトキノンジアジド構造を有する感光材(B)、軟化点が120℃以下であり、かつ130℃以上で(A)中の酸性基と結合しうる反応基を有する化合物(C)を含有する樹脂組成物を段差を有する基板上に塗布して樹脂組成物層を形成し、該樹脂組成物層に活性エネルギー線を照射して現像液と接触させてパターンを形成した後、該組成物を280℃以下で熱硬化することにより得られることを特徴とする平坦化樹脂層。 【選択図】なし

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    US-9786576-B2October 10, 2017Hitachi Chemical Company, LtdPositive-type photosensitive resin composition, method for production of resist pattern, semiconductor device, and electronic device
    WO-2009063808-A1May 22, 2009Hitachi Chemical Company, Ltd.ポジ型感光性樹脂組成物、レジストパターンの製造方法、半導体装置及び電子デバイス
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